Infrastructure
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Process CapabilitiesMicromanufacturing Laboratory is capable of fabricating polymer miniature devices, particularly microfluidic devices and Lab-on-a-Chip, by micromilling, hot embossing, ultrasonic embossing, and PDMS molding. We typically work with polymethylmethacrylate (PMMA), polystyrene (PS), and polydimethylsiloxane (PDMS). |
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Equipment List |
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LPKF ProtoMat S104 PlotterMax. spindle speed of 100,000 rpm 20 tool change positions Capable of machining 150 um wide slots. Used for machining of fine microchannels on thermoplastic substrates. |
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Proxxon MF70 / CNC-Ready Milling MachineMax. spindle speed of 20,000 rpm Manual tool change Dividing head available Capable of machining 400 um wide slots. Used for machining of coarse microchannels on thermoplastic substrates. |
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Proxxon FF500 / BL-CNC Milling MachineMax. spindle speed of 4,000 rpm Manual tool change Dividing head available Used for machining of molds for PDMS molding and ultrasonic assisted or thermal embossing. |
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PROXXON PD400 / CNC LatheSpindle speed ranging between 80 - 2,800 rpm 3-jaw chuck capable of holding workpieces with Ø 100 mm Quick change toolpost with 2 holders Travel distance of 70 mm in X and 300 mm in Z axis Used for manufacturing of sonotrodes for ultrasonic embossing and casings for miniature devices such as micropumps. |
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SONIKEL SNKW-P1-3006 Ultrasonic WelderOperating frequency 30 kHz Output power 600 W Used for manufacturing and bonding of plastic microfluidic devices. |
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MSE LP_M4SH10 Hot PressMax. load of 10 tonnes. Max. platen temperature of 300 oC Used for manufacturing and bonding of plastic microfluidic devices. |
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3D3 Mega Maker S1 FFF 3D PrinterMax. print volume of 250x210x210 mm Resolution of 50 um Max. print speed of 150 mm/s Max. printing bed temperature of 260 oC Used for manufacturing molds for PDMS molding. |
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Diener Zepto One Low Pressure Plasma System100 kHz, max. 30 W generator Cylindrical borosilicate glass chamber with Ø 105 mm Needle valve at air inlet Used for PDMS bonding and surface treatment of plastic substrates. |